Mini LED is a miniature backlight form configured in the full-array area dimming (FALD) area. Its backlight LED chip is smaller, which can achieve a dynamic effect that is finer and closer to pixelation than before, and can effectively improve the screen brightness and contrast. At the same time, it can also control the display of the local area.
The current packaging methods of Mini LED are SMD and COB, and the chips used are positive and flip-chip. Flip-chip COB technology has become the mainstream technology of Mini LED and the main development direction in the future due to its technical advantages in heat dissipation, reliability, power consumption, pixel density, and shortened supply chain.